| 引用本文: | 李 辉,刘盛权,李 洋,杨 东,梁媛媛,刘 静.考虑多热源耦合的风电变流器IGBT模块结温评估模型[J].电力自动化设备,2016,36(2): |
| LI Hui,LIU Shengquan,LI Yang,YANG Dong,LIANG Yuanyuan,LIU Jing.Junction temperature evaluation model for IGBT module of wind-power converter considering multi-thermal coupling[J].Electric Power Automation Equipment,2016,36(2): |
|
| 摘要: |
| 为了更准确地描述大功率风电机组变流器IGBT模块内并联芯片的结温，提出一种考虑多热源耦合影响的变流器功率模块结温评估改进模型。从实际2 MW双馈风电机组变流器IGBT模块内部结构和材料参数出发，利用有限元方法分析IGBT模块内多芯片的结温分布和稳态热耦合影响。引入等效耦合热阻抗概念，推导功率模块芯片间热阻抗关系矩阵，并建立考虑多芯片热源影响的IGBT模块改进热网络模型。以某H93-2MW双馈风电机组为例，对比分析了不同功率损耗下改进模型的芯片结温计算结果与有限元和常规热网络模型结果。结果表明了考虑多热源耦合影响的风电变流器功率模块内部芯片结温计算的必要性和有效性，且热耦合影响程度与不同的芯片间距密切相关，需重点关注非边缘位置芯片的热分布。 |
| 关键词: 风电 变流器 双馈发电机 功率模块 多热源耦合 结温计算 评估 模型 IGBT |
| DOI： |
| 分类号: |
| 基金项目:国际科技合作专项资助项目（2013DFG61520）；国家自然科学基金资助项目（51377184）；中央高校基本科研业务费专项基金资助项目（CDJZR12150074）；重庆市集成示范计划项目（CSTC2013JCSF70003） |
|
| Junction temperature evaluation model for IGBT module of wind-power converter considering multi-thermal coupling |
|
LI Hui1, LIU Shengquan1, LI Yang1, YANG Dong1, LIANG Yuanyuan2, LIU Jing3
|
|
1.State Key Laboratory of Power Transmission Equipment & System Security and New Technology，Chongqing University，Chongqing 400044，China;2.Chongqing KK-QIANWEI Wind Power Equipment Co.，Ltd.，Chongqing 401121，China;3.CSIC（Chongqing） Haizhuang Wind Power Equipment Co.，Ltd.，Chongqing 401122，China
|
| Abstract: |
| In order to more correctly describe the junction temperature of the parallel chips on the converter IGBT module of large wind-power unit，an improved junction temperature evaluation model considering the effect of multi-thermal coupling is proposed. Based on the internal structure and the material parameters of the converter IGBT module of 2 MW DFIG（Doubly Fed Induction Generator），the junction temperature distribution and the steady-state effect of multi-thermal coupling are analyzed with FEM （Finite Element Method）. The concept of equivalent thermal coupling impedance is introduced to deduce the thermal impedance relation matrix among chips of power module and establish an improved thermal network model considering the effect of multi-thermal coupling. With H93-2MW DFIG as an example，the calculated chip junction temperatures are compared among the improved thermal network model，the FEM model and the traditional thermal network model for different power losses. Results show the necessity and effectiveness of the internal junction temperature calculation considering the effect of multi-thermal coupling for the power module of wind-power converter. The effect of multi-thermal coupling is closely related to the interval between chips and great attention should be paid to the thermal distribution of chips in the middle of module. |
| Key words: wind power electric converters doubly fed induction generator power module multi-thermal coupling junction temperature calculation evaluation models Insulated Gate Bipolar Transistors （IGBT） |
